Thermally Conductive Silicone Gap Filler Pad Sarcon EGR-11F for Absorption of Electromagnetic Wave (RFI Shielding)
• Effective to absorb and damp a wide range of electromagnetic waves.
• Also effective as a high performance thermal interface material.
• Easily filling small gaps of IC chip surface with soft gel texture.
• Good workability to simply insert the product between circuit board.
• Self-adhesive gel surface does not require any adhesive tape for assembly.
• Extremely low level of low molecular siloxane.
Información básica:
Fabricante de la marca | 100EG-11F |
Tipo de componente: | Fillers |
Configuración: | Plain |
Especificación: | Soft |
Caso [inch] : | I+W300x200 |
Tipo de material: | Insulating |
Material: Carcasa | Sarcon EGR |
Color | GY - gris 40% |
RoHS | Sí |
REACH | No |
NOVINKA | N |
Embalaje y peso:
Unidad: | pcs |
Peso: | 200 [g] |
Tipo de envase: | BOX |
Paquete pequeño (Número de unidades): | 18 |
Parámetros electrofísicos:
Uisol (@25°C/1min/50Hz) | 500 [V] |
Parámetros térmicos y mecánicos:
Tmin (temperatura mínima de trabajo) | -30 [°C] |
Tmax (temperatura de trabajo máxima) | 120 [°C] |
Thermal conductivity | 1 W/m*K |
Rth Thermal Impedance | 1.36 K-in2/W |
L - Longitud | 300 [mm] |
W - Ancho | 200 [mm] |
T - espesor | 1 [mm] |
Alternativas y sustitutos
Productos alternativos 1: | I+W300x200-100GR-C &FP |