Thermal Pads, Suitable for TO-247, Adhesive Wax, Silicone Free
Dp60-Series is a highly thermally conducting and electrically insulating, silicone free material. The Kapton® MT polyimide film as a heat conducting and electrically insulating substrate carrier coated phase-change coumpound on both sides thus optimising the thermal path e.g. between electronic packages and heat sinks. Although thermal conductivity value looks as lower, the final thermal resistance is excelent. Material is suitable for thermally demanding applications.
Información básica:
Fabricante de la marca | L05-K1.5-F21x24mm |
Especificación: | Soft |
Construcción: | Full |
: | 21x24 TO247 |
Caso [inch] : | I+TO247 full |
Tipo de material: | Insulating |
Material: Carcasa | Kapton+Wax (Phase Ch |
Color | !_og-orange_! |
RoHS | Sí |
REACH | No |
Embalaje y peso:
Unidad: | pcs |
Peso: | 0.070002 [g] |
Tipo de envase: | BOX |
Paquete pequeño (Número de unidades): | 100 |
Parámetros electrofísicos:
Uisol (@25°C/1min/50Hz) | 6000 [V] |
Parámetros térmicos y mecánicos:
Tmin (temperatura mínima de trabajo) | -60 [°C] |
Tmax (temperatura de trabajo máxima) | 140 [°C] |
Thermal conductivity | 0.46 W/m*K |
Rth Thermal Impedance | 0.147 K-in2/W |
Rth shape | 0.188 K/W |
L - Longitud | 24 [mm] |
W - Ancho | 21 [mm] |
T - espesor | 0.063 [mm] |
Alternativas y sustitutos
Alternativa 1: | 178733 - I+TO247-K21x24-KG38 (AAV) |
Productos alternativos 1: | TPC-S050-KA |
Productos alternativos 2: | KU-KG38 |
Productos alternativos 3: | KU-KG38-0H-ST-6-624/0-L |